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NANOG Meeting Presentation Abstract

Optics Technology Advances
Meeting: NANOG58
Date / Time: 2013-06-03 3:15pm - 3:45pm
This item is webcast
Room: Crescent City Ballroom
Presenters: Speakers:

Chris Cole, Finisar

Chris Cole is a Director at Finisar Corp., Sunnyvale, Calif. He received a B.S. in Aeronautics and Astronautics, and B.S. and M.S. in Electrical Engineering from the Massachusetts Institute of Technology. At Hughes Aircraft Co. (now Boeing SDC) and then M.I.T. Lincoln Laboratory, Chris contributed to multiple imaging and communication satellite programs such as Milstar. Later, he consulted on telecom ASIC design for Texas Instruments DSP Group and Silicon Systems Inc. (now Maxim.) Chris was one of the architects of the Sequoia coherent imaging ultrasound platform at Acuson Corp. (now Siemens Ultrasound), where he also managed hardware and software development groups. As a principal consultant with the Parallax Group he carried out signal processing analysis and product definition for several imaging and communication systems. At BBN, a Finisar acquisition, Chris developed 10 Gb/s and 40 Gb/s optical transceivers. He is now managing the development of 100 Gb/s and 400 Gb/s optical standards and transceivers. He is a Senior Member of the IEEE.
Abstract: The pace of optics technology development has been increasing. Some of the advances are similar to past innovation, in particular increases in per lane data rate, for example from 1Gb/s to 10Gb/s to enable increase in link data rate from 1GbE to 10GbE. Other advances are new, for example parallel fiber and wavelength division multiplexing (WDM) that enabled 40GbE and 100GbE.

There are future technologies, such as higher order modulation (HOM) which will be combined with the past innovations to lead to future data rate increases to 400GbE and 1.6TbE. Some of these advances are transparent to network operators, like lane rate increase, WDM and HOM. Others like parallel fiber lead to operational changes. The per lane data rate increases will accelerate the shift from copper to fiber because of physics limitations, which will change datacenter cabling. Innovations such as ML (multi-link) pluggable modules, OEs (board mounted optical engines), and new light sources will enable higher density, flatter interconnect, which will require operational changes in breaking out and aggregating individual links.

Technology improvements will reduce the energy per bit/sec, however this will not be sufficient to offset the increases in speed and density, and thermal management will become more demanding.
Files: pdfOptics Technology Advances(PDF)
youtubeOptics Technology Advances
Sponsors: None.

Back to NANOG58 agenda.

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